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Product name

GT-FC300-1.1

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Shenzhen Getian Opto-electronics Co., Ltd.

 
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GT-FC300-1.1
Flip Chip for High Bay
High Bay Lights LEDs Flip Chip
GT-FC300(SP1010)
Power:FC60-300W
Luminous area:13.48*13.48mm
RoHS compliant
5 Years Warranty
High CRI COB LED Chip Description
High Reliability and Stability
Ceramic base with flip chip mounted, no gold wire bonding
High heat conductivity red copper substrate
High temperature eutectic welding technique
Reliable raw materials applied with super fast heat transfer
Patented phosphor coating techonology
Outstanding Projecting Performance
High power & lux density with super even light distribution
Minimum distance in-between China Flip Chip for High Bay to achieve surface emitting effect
Extremely small LES optimized for focused lighting purpose
Flexible Application Features of High Stability Flip Chip
Equipped with temperature sensor and quick connector
A wide power range from 10W to 800W optional
High Bay Light Flip Chip Application: stage light, projector, searchlight and long-distance lighting applications,etc
Product Specification

Product Type

LES
(mm)

CCT
(K)

CRI

φ
(lm)

Power
(W)

VF
(V)

IF
(A)

Chip Array

GT-FC60X3-1.1

6.66*6.66

8000-8500

70

4500-5000

60

15-19

3.75

SP0505

GT-FC90X3-1.1

6.66*6.66

8000-8500

70

6300-7200

90

15-19

5.5

SP0505

GT-FC150X3-1.1

9.64*9.64

8000-8500

70

10000-12000

150

21-25

6.7

SP0707

GT-FC300X3-1.1

13.48*13.48

8000-8500

70

20000-22000

300

30-36

10

SP1010

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